multilayer ceramic chip capacitors 1 of 3 creation date : may 16, 2017 (gmt) c2012x5r0j106m085ab tdk item description c2012x5r0j106mt**** applications commercial grade feature general general (up to 50v) series c2012 [eia 0805] status production (not recommended for new design) size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 0.85mm 0.15mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 10f 20% rated voltage 6.3vdc temperature characteristic x5r(15%) dissipation factor (max.) 10% insulation resistance (min.) 10m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : may 16, 2017 (gmt) c2012x5r0j106m085ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c2012x5r0j106m085ab esr c2012x5r0j106m085ab capacitance c2012x5r0j106m085ab dc bias characteristic c2012x5r0j106m085ab temperature characteristic c2012x5r0j106m085ab(no bias) ripple temperature rising c2012x5r0j106m085ab(100khz) c2012x5r0j106m085ab(500khz) c2012x5r0j106m085ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : may 16, 2017 (gmt) c2012x5r0j106m085ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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